The world’s first fully integrated Xe plasma source FIB with SEM
It enables extremely high ion currents up to 2 μA thus increasing sputtering rate more than 50 times compared to conventional Ga source. This predetermines FERA3 for milling big volumes of materials that were time consuming or impossible so far.
This new generation of scanning electron microscopes equipped with focused ion beam column provides users with the advantages of the latest technology, such as new improved high-performance electronics for faster image acquisition, ultra-fast scanning system with compensation of static and dynamic image aberrations or built-in scripting for user-defined applications.
They were designed with respect to a wide range of FIB-SEM applications and needs in today’s research and industry. The excellent resolution at high beam current values as well as the powerful software turns the TESCAN FIB-SEMs to excellent tools not only for the analytical but also for many other applications in different field of research and industry.

Modern electron optics

  • The unique Wide Field Optics™ design with a proprietary Intermediate Lens (IML) offers a variety of working and display modes with enhanced field of view or depth of focus
  • Real time In-Flight Beam Tracing™ for performance and beam optimization. Also includes direct and continual control of beam parameters.
  • Fully automated electron optics set-up and alignment
  • Fast imaging rate
  • Unique live stereoscopic imaging using advanced 3D Beam
  • Technology opens up the micro and nano-world for an amazing 3D experience and 3D navigation

Documents for download

FERA3 brochure
The world’s first fully integrated Xe plasma FIB-SEM. Download FERA3 brochure!

3D BSE reconstruction of an IC

FIB-SEM tomography of a 100 µm-diameter C4 solder bump